Homework assignments for ECE 510/410 Spring 2008
Homework guidelines are found here.
All layouts and schematics should be drawn using Electric.
Simulations should be performed using LTspice.
Drawing schematics using LTspice will result in zero credit.
Course projects – Due Wednesday,
May 7. Read the policy on the course
webpage concerning turning in late work. These projects are NOT group efforts.
What you turn in should be your own work. I will ask my TAs for help in looking
for layouts that are common in two project jelib
files (so do your own work!)
Your project reports should
detail:
·
The reasons for
the topology you selected
·
Design
considerations
·
Hand calculations
with comparisons to simulations (with and without parasitics)
·
A pin diagram for
the layout (how to connect the layout to bond pads if we fabricate the design)
·
Clear layout
documentation (zoomed in and outlines of the layout for easy grading).
·
Layout should be
as “tight” as possible.
·
Email me
your (clean) Jelib file and project report in PDF or
Word formats.
·
I should be able
to figure out what to simulate and how to simulate it without any effort (make
sure this is very clear!)
·
I will have the
MOSFET models in C:\Electric\C5_models.txt
·
I’ll perform an
LVS and a DRC on what you send (so make sure everything is clean before
emailing me!)
·
I should receive the electronic report and jelib via email (jbaker at
boisestate.edu) prior to the beginning of class (5 pm) on Wednesday May 7,
2008.
EE 510/410 project –
HW18 – due Wednesday, April 30, Problems: A12.1, A12.3, A13.1, and A13.2
HW17 – due Wednesday, April 16, Problems: A11.8, also send me the layout of your bandgap reference before 5 pm on this day per the way we’ve done this in the past (see below, that is, clean jelib, unique name, etc.)
HW16 – due Wednesday, April 9, Problems: A10.7, A10.8, A11.1, A11,2, A11.3
HW15 – due Wednesday, April 2, Problems: A10.1, A10.2, and A10.3. Do the optional SPICE simulations. Make sure you use Electric to draw the schematics.
HW14 – due Monday, March 31, repeat the first part of HW9 for an 11-stage ring oscillator with an enable (see Fig. 18.41 without the extra capacitors). The file you email me should have three icon views (the inverter, the NAND gate, and the ring oscillator), three layouts, and three schematics (of course the ring oscillator schematic uses the inverter and NAND icons), A6.13, A6.15, A6.16, A6.19.
HW13 – due Wednesday, March 19, repeat the first part of HW9 for a NOR gate, A6.6, A6.8, and A6.9.
HW12 – due Monday, March 17, repeat the first part of HW9 for a NAND gate (instead of an inverter). Please make sure your icon looks like a NAND gate (no box around the gate, solid fill, or other non-standard artwork), A6.2 and A6.4
HW11 – due Wednesday, March 5, A5.4, A5.7, A5.8, and A5.10
HW10 – due Monday, March 3, lay out a 100/2 and a 5/100 PMOS device (in as square of an area as possible). Show how to connect the devices to 4 pads (D, G, S, and VDD). Make sure you LVS and DRC your cells. A5.1, A5.2, and A5.3
HW9 – due Wednesday, February 27, lay out an inverter using a 20/2 PMOS and a 10/2 NMOS, make an icon for the inverter. Make sure you LVS and DRC your final cells (schematic, layout, icon). Email a clean (nothing in the library except for what’s required in this problem) jelib file with a name “myname.jelib” where myname is your name (of course) to jbaker at boisestate.edu before class starts on Wednesday (no simulations required at this point). Ensure you have set, in the Preferences, Tools, Well-Check, that your p-well (substrate for us since we are not using a twin-well process) must be connected to ground and the n-well must be connected to VDD. Of course, turn in hardcopy (say two pages) showing the solution to this problem for the graders.
HW8 – due Monday, February 25, A4.1, A4.2, A4.3
HW7 – due Wednesday, February 20, A3.3, A3.4, A3.5, A3.11, and A3.12
HW6 – due Wednesday, February 13, 1) Lay out a padframe for a chip size of 1.5 mm square assuming that the pads are made with metal3 (only) and are 75 um square. What is the parasitic capacitance of the bonding pad? Ensure that you are using the C5 process scale factor (300 nm) and parasitics. 2) repeat part 1) but use pads that are made with metals 1, 2, and 3 (noting that the metal layers are connected together so that any metal layer can be run into the pad). Again what is the parasitic capacitance of the pad? 3) problems A3.1, A3.2
HW5 – due Monday, February 11, 1) Layout a diode using n-well and p-substrate that has an area (of n-well) of 12 by 12. DRC and LVS your layout/schematic. 2) using this diode and the SPICE parameters seen in Ex. 2.4 simulate the DC behavior of the diode (IV curve), the diode’s reverse recovery time, and how you would measure the diode’s junction capacitance for a particular reverse bias potential between the n-well and substrate (in this class the substrate is grounded unless otherwise indicated). 3) problems A2.5, A2.7, and A2.8.
HW4 – due Wednesday, February 6, 1) generate an icon in Electric for the schematic of the design in HW3 (icons are only used in schematics, that is, they are not used in layouts). Show how the two circuit outputs change for a .DC sweep of VDD from 0 to 5V, A2.2, A2.3
HW3 – due Monday, February 4,
1) Design, lay out (using only the n-well layer), and simulate a circuit that provides two reference voltage outputs: 0.4VDD and 0.6VDD. The circuit’s inputs are VDD and GND. For your design use only the 10k resistor layout (as many times as needed) from HW2. Make sure you LVS and DRC your final design. Email a clean (nothing in the library except for what’s required in this problem) jelib file with a name “myname.jelib” where myname is your name (of course) to jbaker at boisestate.edu before class starts on Monday (I should be able to simulate your cells). Of course, turn in hardcopy showing the solution to this problem for the graders. The jelib you send to me is for me to ensure that you have a fundamental understanding of Electric, LTspice, and the thus the flow and likely won’t be graded (but the graders will grade your hardcopy solution!).
2) If a 100 ohm resistor is added from Vout to ground in the circuit seen in Fig. 1.24 then use hand calculations to determine the circuit’s behavior. Verify your hand calculations with SPICE (generate the netlist using Electric). Comment intuitively on why the effective RC time constant drops.
3) Simulate, using both an AC and a transient, or pulse input, simulation the circuit seen in Fig. 10.24b (a scope probe). Using hand calculations adjust the value of the variable 15 pF capacitor in the tip of the probe to ensure that there is a 1/10 divider between the probe’s tip and the input of the scope (note that some scope probes put the variable capacitor across the input of the scope and used a fix value, say 12 pF, in the probe’s tip). Verify with SPICE. Also plot the AC impedance at the probes tip against frequency (apply an AC test voltage to the probe tip then divide this voltage by the current flowing through it). At very low frequencies the resistance is 10 MEG while at high frequencies the impedance becomes capacitive. Note that this SPICE simulation should only have 6 components (an input voltage source, two resistor’s, and 3 capacitors). Further note that the resulting circuit should only have two signal nodes (the probe tip and the scope’s input).
HW2 – due Wednesday, January 30, 1) Layout a resistive divider using two nominally 10k, n-well resistors, do an LVS (NCC) on your cells (we will do this problem in class on 1/28 after we introduce the n-well layer), 2) sketch the time-domain input and output for the RC lowpass filter seen in Fig. 1.21 with R = 1k, C=1pF, and an input sinewave at frequency of 200e6 Hz having a peak amplitude of 1V. Verify your hand sketches with SPICE. 3) A1.7
HW1 – due Monday, January 28, Draw a box that measures 10 by 20 using the n-well layer, A1.3, A1.4, A1.5