Author: Windows User

Test Setup #1
Package: SSOP 28

Selected Pins for Bonding for test setup #1

Bonding Diagram for test setup #1

SSOP 28

11

128

2

27

33

326

4

25

5

24

6

23

7

22

8

21

9

20

10

19

11

18

12

17

13

16

14

15

On Chip Pin	Package Pin #
20	1
21	2
22	3
23	4
24	5
25	6
26	7
27	8
28	9
29	10
30	11
31	12
GND	13
2	14
APD MIN SIZE Lower	15
APD MIN SIZE Upper	16
APD 4_8 Lower	17
APD 4_8 Upper	18
8	19
11	20
12	21
13	22
14	23
15	24
16	25
17	26
18	27
19	28

For Test Setup #1

Test Setup #2
Package: SSOP 16

Selected Pins for Bonding test setup #2

Bonding Diagram for test setup #2

SSOP 16

11

16

2

15

3

14

4

13

5

12

6

11

7

10

8

9

Note: Chip is rotated 90 degrees Clockwise

On Chip Pin	Package Pin #
GND	1
1	2
2	3
3	4
4	5
5	6
6	7
7	8
8	9
9	10
10	11
19	12
22	13
23	14
24	15
25	16

For test set up #2

Chip #2 Bond plan 1

5

4

3

2

1

40

39

38

37

36

6

35

7

34

8

33

9

32

10

31

11

30

12

29

13

28

14

27

15

26

16

17

18

19

20

21

22

23

24

25

Bond Plan #1

3

2

1

G

28

27

26

4

25

5

24

6

23

7

22

8

21

9

20

10

19

11

18

12

13

G

14

15

16

17

Bond plan #1

On Chip Pin	Package Pin #
1	1
2	2
6	3
7	4
8	5
9	6
10	7
11	8
12	9
13	10
14	11
15	12
16	13
17	14
18	15
19	16
20	17
21	18
22	19
23	20
29	21
30	22
31	23
32	24
33	25
34	26
35	27
40	28

Bond plan #2

5

4

3

2

1

40

39

38

37

36

6

35

7

34

8

33

9

32

10

31

11

30

12

29

13

28

14

27

15

26

16

17

18

19

20

21

22

23

24

25

Bond plan #2

3

2

1

G

28

27

26

4

25

5

24

6

23

7

22

8

21

9

20

10

19

11

18

12

13

G

14

15

16

17

Bond plan #2

On Chip Pin	Package Pin #
1	1
2	2
3	3
4	4
5	5
9	6
10	7
11	8
12	9
13	10
14	11
15	12
16	13
20	14
24	15
25	16
26	17
27	18
28	19
29	20
30	21
31	22
32	23
36	24
37	25
38	26
39	27
40	28